High temperature Probe Cards

- The design of our product allows you to maintain work stability and make measurements in the temperature range from - 50 to 150 ºC.

- We have great experience of design and manufacturing High temperature probe cars with multi-level complex configurations.

- “Aktagor-Telecom” JSC has been developing a technology for probe cards construction, which would provide appropriate and correct testing within the temperatures from -50°C up to +250°C.

- Beside the circuit board material, an extremely important role goes to characteristics of the epoxy compound, used by process of gluing.

- We are currently manufacturing testing devices for various temperature ranges.

- For testing at temperatures up to 120 ° C or 150 ° C, other carrier materials must be used for the construction of the spider, and at temperatures above 200 ° C we recommend a completely different solution, which can be consulted by our engineers if necessary.

Table of standard parameters:

Parameter Value
X-Y probe positioning (µm) <±10
Planarity (µm) <12
Pad pitch (µm) <70
Pad size (µm) min 45х50
Accuracy for the working height provided (mm) ±0.25

KEY FEATURES
• Ability to use at high temperatures from -50 to 150 ° C and above (OVERTEMPERATURE)
• Excellent longevity
• MultiDUT (multi- die-testing)
• Excellent probes planarity and X, Y alignment
• Low tip wear
• Pitch below 70 (µm)
• Probe and PCB material
• Needle materials: Tungsten (W), Tungsten Rhenium (WRe), Beryllium Copper (BeCU) and Palladium alloy (Pd)
• Stable Contact Resistance (Cres)
• Leakage in the pA range

APPLICATION
• MEMS
• MultiDUT (multi- die-testing) parralel test
• Mixed signals
• Analog signals
• Digital signals
• Contact on BGA-balls
• Flip chip
• WLCSP
• Memory
• LEDs
• SoC/Logic
• LCD Driver
• Microprocessor
• CMOS Image Sensor
• Ceramic substrates
• other devices