Epoxy Probe Cards

- This type of card provides a large number of contacts and a short production time.
- Used for testing: MEMS, MultiDUT (multi-die-testing) parralel test, Mixed signals, Analog signals, Digital signals, Contact on BGA-balls, Flip chip, WLCSP, Memory, LEDs, SoC / Logic, LCD Driver, Microprocessor , CMOS Image Sensor, Ceramic substrates and other devices.
- The design of the product allows multi-tiered, parallel, standard (each probe is angled with respect to the previous one) and complex configurations of constructions. This allows you to place a large number of probes in the product of 600 or more, with a minimum inter-center location of sites (pitch size).
- Provides the ability to test multiple crystals at once (MULTI-DIE-TESTING).
- The products can contain edge sensors of different types (at the request of the customer).
- We work with all major probes needles materials:
Tungsten (W), Tungsten Rhenium (WRe), Beryllium Copper (BeCU) and Palladium alloy (Pd).
- We working with a variety of superior engineering materials and we can accommodate most requirements demanded by specialist applications.
- Epoxy Probe Cards work at temperatures from -50 to 85 ° C, but if you need a temperature range from -50 to 150 ° C and above, we can offer High temperature Probe Cards.

Table of standard parameters:

Parameter Value
X-Y probe positioning (µm) <±10
Planarity (µm) <12
Pad pitch (µm) <70
Pad size (µm) min 45х50
Accuracy for the working height provided (mm) ±0.25

• Excellent longevity
• Number of probes 600 or more
• MultiDUT (multi- die-testing)
• Excellent probes planarity and X, Y alignment
• Low tip wear
• Pitch below 70 (µm)
• Probe and PCB material
• Needle materials : Tungsten (W), Tungsten Rhenium (WRe), Beryllium Copper (BeCU) and Palladium alloy (Pd)
• Stable Contact Resistance (Cres)
• Leakage in the pA range

• MultiDUT (multi- die-testing) parralel test
• Mixed signals
• Analog signals
• Digital signals
• Contact on BGA-balls
• Flip chip
• Memory
• LEDs
• SoC/Logic
• LCD Driver
• Microprocessor
• CMOS Image Sensor
• Ceramic substrates
• other devices